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Digital Intelligence Powers Intelligent Cabinet Manufacturing | Hiprecise × Yipan Strategic Partnership, Helping to Build a New Data-Driven Manufacturing Paradigm

Hiprecise and Yipan have joined forces to build an end-to-end digital solution, spanning from 3D electrical design to intelligent wiring harness equipment, thereby driving the upgrade of the switchgear manufacturing industry and jointly creating a new chapter of cooperation.

Hiprecise and Yipan signed a technical strategic cooperation agreement.

 

On August 27, 2026, Xiamen Hiprecise Technology Co., Ltd. (hereinafter referred to as “Hiprecise”) and EasyPain Software (Shanghai) Co., Ltd. (hereinafter referred to as “EasyPain”) successfully signed the “Technical Strategic Cooperation Agreement” in Xiamen. Mr. Li Putian, Chairman of Hiprecise, and Mr. Anders Danås, President of EasyPain for the Asia-Pacific region, signed the agreement on behalf of their respective companies, marking the beginning of a new chapter of strategic cooperation between the two parties. This collaboration will leverage their core strengths to drive the digital and intelligent transformation of switchgear manufacturing.

 

 

This collaboration adheres to the principles of equality and mutual benefit, complementary strengths, resource sharing, and win-win outcomes, focusing on data integration in panel, cabinet, and wire harness manufacturing, as well as seamless information flow between design and manufacturing processes. It aims to ensure that electrical design data flows seamlessly from the drawing stage through to downstream processing and marking operations, thereby precisely empowering Hiprecise’s intelligent manufacturing equipment. Promote the evolution of wire harness manufacturing in the panel and cabinet industry from “drawing‑driven manual processes” to “data‑driven manufacturing.” 。

 

 

This is more than just a technological collaboration—it is a strategic partnership aimed at empowering industrial automation through shared value. . Hiprecise will be rooted in the local market, deeply cultivating intelligent manufacturing, and partnering with cutting-edge global technological resources to break down industry-specific data and technology barriers, jointly building a new ecosystem for efficient, intelligent, and standardized panel cabinet manufacturing—moving forward together, achieving mutual success, and creating a win-win future.

 

Seamlessly integrate the design-to-manufacturing data chain, empowering panelboard manufacturing to achieve quality improvement and efficiency gains.

 

Currently, the panel‑cabinet manufacturing industry widely faces the pain point of a disconnect between design data and machining equipment: drawings cannot be directly interpreted by machines, and wire preparation and busbar fabrication rely on manual labor. This not only results in low efficiency but also increases the likelihood of errors, thereby hindering delivery timelines and quality control.

 

This collaboration Centered on seamless data integration, transform design assets into actionable productivity. :

 

Relying on the Eplan professional electrical design platform, after completing the electrical schematic design, wire parameters are automatically calculated and standardized wiring work orders are generated. Design changes are instantly synchronized to Hiprecise intelligent equipment, eliminating manual transcription and conversion and significantly shortening the data preparation cycle.

 

The work order is routed directly to the Hiprecise secondary wire intelligent processing center, where the equipment automatically performs processes such as cable cutting, stripping, threading, and crimping. All processing parameters are derived from the design stage, which not only boosts manufacturing efficiency but also effectively eliminates human error, ensuring cable consistency.

 

 

Leveraging its advantage of end-to-end data integration, Hiprecise intelligent equipment can directly access design data, automatically perform laser marking on cable identifiers and precisely sleeve cables, ensuring a one-to-one correspondence among wire numbers, drawing numbers, and physical cables, with unified, source‑consistent data. This provides precise data support for subsequent assembly and commissioning, equipment maintenance, and quality traceability, thoroughly resolving the issues of chaotic traditional process labeling, tedious verification, and difficult traceability.

 

Hiprecise’s independently developed busbar composite processing center has achieved fully integrated, automated operations across the entire busbar manufacturing process. By partnering with EPLAN this time, it will establish an end-to-end data link spanning from electrical design to production order placement. Leveraging the technical compatibility of both parties, EPLAN electrical design drawings can be directly parsed and recognized by the equipment, with design parameters automatically converted into standardized production work orders—eliminating the need for manual re-entry and conversion—and enabling precise coordination among all automated processes, including material feeding, laser marking, punching and shearing, bending, and material unloading.

 

 

The design and manufacturing processes are fully transparent, with conductors cut to precise lengths to minimize waste, reduce reliance on manual labor, and free up human resources to focus on higher-value activities—laying a robust data foundation for building smart factories.

 

Digital‑intelligent collaboration empowers panel‑cabinet manufacturing, jointly building a new industrial digital ecosystem.

 

Relying on technological collaboration, ecosystem integration, and data interoperability, the two parties will strengthen end-to-end industrial digitalization capabilities and jointly promote data-driven applications for industrial standardization and intelligent manufacturing. Building on a solid foundation of data interoperability, they will further expand the depth and breadth of their cooperation, focusing on joint interface development to continuously deepen the data interfaces between the Eplan platform and Hiprecise’s HPC/SPC secondary-line intelligent processing centers and busbar intelligent processing centers, covering more wire-processing techniques, busbar specifications, and equipment models.

 

Every time a design takes shape, it ultimately reaches the manufacturing stage.

Where data flows seamlessly, efficiency naturally takes root.

From blueprints to equipment, from planning to delivery,

Hiprecise and Yipan ,

Every step of disk enclosure manufacturing,

Everything is based on evidence and fully traceable.

Build from 3D electrical design to

of intelligent wire harness equipment

End-to-end digital solutions

Supporting the upgrade of the intelligent manufacturing industry for cabinets and enclosures.

Join hands to create a new chapter of cooperation.

 

 

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